BDL-51002 Photosensitive Solder Mask Ink
Product Introduction:
Application Fields:
Liquid photosensitive solder mask ink forms a permanent protective layer, preventing PCB copper oxidation, moisture intrusion, solvent corrosion, and physical damage. It also enhances the electrical insulation of circuits, extending the service life of printed circuit boards (PCBs).
The primary application method is screen printing. After coating the etched substrate, it undergoes pre-baking, exposure, development, and final curing, forming a cross-linked polymer layer. The solder mask offers high brightness, hardness, adhesion, excellent thermal shock resistance, acid-alkali, and solvent resistance.
Technical Parameters:
Item Test Conditions Test Results Fineness Scraper fineness method; < 5μm PASS Viscosity VT-04F viscosity measurement method (25°C); 160±20 dPa.s 160dPa.s Screen Printing Screen printing method; uniform color, no air bubbles, no shrinkage, no white spots PASS Pre-baking 75°C ± 5°C; not sticking to the film PASS Photosensitivity 7K, 8K exposure energy 9-12 levels PASS Developing 1% Na2CO3 solution, 30°C; clean surface and holes, no over-developing PASS Curing 150 ± 5°C, 60 minutes, ink fully cured PASS Adhesion IPC-SM-840 3.5.2.1/IPC-TM-650 2.4.28.1; cross-cut test, tape peel test 100/100 Pencil Hardness IPC-SM-840C 3.5.1/IPC-TM-650 2.4.27.2; no damage to coating, copper not visible ≥6H Solder Resistance Rosin flux; floating solder method: 288°C/10 seconds x 3 PASS Solvent Resistance Propylene glycol methyl ether acetate; soaked at room temperature for 30 minutes, tape peel test PASS Acid Resistance 10vol% H2SO4; soaked at room temperature for 30 minutes, tape peel test PASS Alkali Resistance 10wt% NaOH; soaked at room temperature for 30 minutes, tape peel test PASS This technical data is based on company test results and is for reference only. Customers should perform their own validation tests and set suitable usage conditions.
Operating process parameters：
Item Test Conditions Test Results Fineness Scraper fineness method; < 5μm PASS Viscosity VT-04F viscosity test (25°C); 160±20 dPa.s 160dPa.s Screen Printing Screen printing; uniform color, no air bubbles, no shrinkage, no white spots PASS Pre-bake 75°C ±5°C; no sticking to the film PASS Photosensitivity 7K, 8K exposure machine energy 9-12 levels PASS Development 1% Na2CO3 solution at 30°C; clean surface and holes, not overdeveloped PASS Curing 150 ± 5°C, 60 minutes; ink fully cured PASS Adhesion IPC-SM-840 3.5.2.1/IPC-TM-650 2.4.28.1 cross-cut test, tape peel-off test 100/100 Pencil Hardness IPC-SM-840C 3.5.1/IPC-TM-650 2.4.27.2; no damage to the coating, copper not visible ≥6H Solder Resistance Rosin flux; float solder: 288°C/10s ×3 times PASS Solvent Resistance Immersed in propylene glycol methyl ether acetate at room temperature for 30 minutes, tape peel-off test PASS Acid Resistance 10vol% H₂SO₄; immersion at room temperature for 30 minutes, tape peel-off test PASS Alkali Resistance 10wt% NaOH; immersion at room temperature for 30 minutes, tape peel-off test PASS This technical data is based on the company's test results and is provided for reference only. Customers must conduct confirmation tests and establish appropriate usage conditions before use.
Application Scenarios:
The BDL-51002 Photosensitive Solder Mask Ink is widely used in printed circuit boards (PCBs) to protect copper surfaces from oxidation, moisture, and physical damage, improving the board's electrical insulation and extending its lifespan. This product is particularly applicable in industries such as electronics manufacturing, telecommunications, and high-tech equipment.
For distributors in Latin America, the Middle East, and Africa, potential markets include electronics manufacturers, automotive suppliers, and telecommunications companies. Suitable agents should have access to local electronics manufacturers, a solid logistics network, and knowledge of local regulatory standards. Developing relationships with companies involved in electronics and PCB manufacturing would be essential for market development. These regions present growing opportunities in consumer electronics, infrastructure, and industrial equipment, where PCBs are crucial components.
